Overview

Qualcomm’s MDDI standard provides a proven solution for the interconnect challenge between the upper and lower clamshell in a flip phone. The MDDI high-speed solution supports variable data rates of up to 3.2 Gbps. The solution decreases the number of signals that connect the digital baseband controller with the LCD display and camera from as many as 90 to as few as eight pins plus power. This reduction in the interconnect complexity decreases the cost of interconnect, increases reliability and reduces the complexity of handset integration by eliminating multiple synchronous high-speed signals through the hinge in advanced multimedia handsets equipped with high-resolution LCD displays and cameras.

The integration of MDDI enables the adoption of advanced features, such as high-definition (QVGA) LCDs and high-resolution megapixel cameras for wireless devices and supports capabilities such as driving a PowerPoint® presentation on an external display or a video projector from a handset.

A Video Electronics Standards Association (VESA) approved standard, the MDDI solution is currently available and integrated into select Qualcomm chipsets. These are the first MDDI-enhanced chipsets intended for multimedia handsets. Qualcomm intends to integrate MDDI technology into the full range of next-generation CDMA/UMTS baseband chip and promote the MDDI solution jointly with the industry leaders of LCD panels and megapixel camera.

Benefits

As multimedia functionality supporting high-resolution photos and video in mobile handsets increases and consumer demand for feature-rich handsets grows, the MDDI standard provides long-range benefits for LCD and camera manufacturers, as well as OEMs.

• Reduced wire count translates to lower cost, increased reliability and reduced power consumption
• Integrates directly to the MSM^TM, requiring no additional auxiliary components or modules
• Provides a complete, proven solution – Qualcomm’s chipsets interface with most LCD and camera configurations
• Offers a solid standard that is available now
• Shortens development cycles and testing time – enabling faster time-to-market

Key Functionality

• Open standard supported by VESA
• High-speed, bidirectional data transfer that supports rates of up to 3200 Mbps
• Simple clock recovery; allows variable data rates for greater system design flexibility
• Hibernation state for very low power consumption
• Combined physical-layer and link-layer provides a complete solution
• Multiple data types simultaneously in both directions (e.g., stereo video + audio + control/status + keyboard + pointing device)
• Reduced traffic on system memory bus (data is sent only when the image changes)